International Connector Innovation Forum
Apr 15, 2025丨Room M10 (2nd floor) in Hall W3，SNIEC
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International Connector Innovation Forum
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Topics:
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Forum agenda
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On site photos of the forum
International Connector Innovation Forum
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Forum Date
Apr 15, 2025
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Forum Venue
Room M10 (2nd floor) in Hall W3, SNIEC
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Organizer
Messe Muenchen Shanghai Co., Ltd.
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Topics:
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Research on technology integration, innovation and application of connectors in emerging industries (rail transportation, new energy vehicles, 5G communication, public healthcare, etc.)
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Discussion on key materials, key process equipment and testing instruments of connector
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Discussion on chain digital transformation and innovation in connector industry
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Discussion on connector Intelligence and Low Carbon Production
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Display of innovation achievements of regional industrial clusters and enterprise industry chains (enterprises that have been awarded the titles of national and provincial champions and small giants of “specialization and innovation”)
Forum agenda
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Time
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Presentation
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Speaker
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9:30-12:15
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AM Session: Latest Development of Connector Basic Generic Technologies, Such as Design
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Moderator:Liangjun Xu, Professor, Beijing University of Posts and Communications
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9:30-9:45
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Registration
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9:45-10:15
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Connector Design and Manufacturing in the Era of Artificial Intelligence
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Liangjun Xu, Professor, Beijing University of Posts and Telecommunications
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10:15-10:45
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Copper alloy innovations boost technology development for high-speed interconnects
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Liu Feng, R&D director, Xingye Alloy Materials Group Co., Ltd.
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10:45-11:15
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The application of fine-grained brass trip in the connector industry
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Li zhenyu, Chief Technical Engineer, Ningbo Jintian Copper (Group) Co., Ltd.
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11:15-11:45
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Material Innovations for Next Generation Connectors
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Global Marketing Manager, Syensqo
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11:45-12:15
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In the era of artificial intelligence, how can high-performance copper alloys build a solid "highway" for data transmission?
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Jason ZHANG, Technical Marketing Director, Ningbo Boway Alloy Plate and Strip Co., Ltd.
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13:00-16:30
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PM Session: Development Trend of Connector
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Moderator: YUNG CHUAN PENG, Secretary General, Taiwan Electronic Connector Association (TECA)
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13:00-13:30
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Low-voltage Aluminum Wire Connection Technology
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Field Sun, VP & GM ,TE Automotive China
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13:30-14:00
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Amphenol's Holistic Vision for Equitable Intelligent Driving
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Justin Dong,FAE Manager,Amphenol Communications Solutions
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14:00-14:30
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Development Trends of Charging Inlet Product Technology
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Li Hao, Product Manager of Electric Vehicle BU of JONHON Optronic Technology Co.,Ltd.
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14:30-15:00
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Electrical connector solutions for E-mobility
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Chu Hualei, E-mobility Industry Expert, Staubli
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15:00-15:30
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Between milimeters, connection is inifite: Phoenix Contact FINEPITCH board-to-board connector
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Suri Sun, BTB Connector Product Manager, Phoenix Contact China
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15:30-16:00
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ST60 contactless connectivity, opening the "wireless" imagination of the machine era movement
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Danny SHENG, Technical Marketing Manager, China RCD mmW Product Line STMicroelectronics
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16:00-16:30
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Trump 2.0 shocked Interconnection Industry
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Dr. YUNG CHUAN PENG, Secretary General, Taiwan Electronic Connector Association (TECA)
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The agenda of conference shall be subject to the announcement on that day.
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