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  • 2025 Third Generation Semiconductor Technology and Application Forum

    Apr 15, 2025丨Room M51 (2nd floor) in Hall N5,SNIEC

    ON THIS PAGE

    • 2025 Third Generation Semiconductor Technology and Application Forum

    • Topics:

    • Forum Agenda

    • On site photos of the forum

    2025 Third Generation Semiconductor Technology and Application Forum

    • Forum Date

      Apr 16, 2025

    • Forum Venue

      Room M46 (2nd floor) in Hall N4, SNIEC

    • Organizer

      Power Supply Network 

      Messe Muenchen Shanghai Co., Ltd.

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    Topics:

    • Technical development of new power devices

    • Development and characteristics of wide band gap devices

    • Application of new power devices

    Forum Agenda

      • Time

      • Presentation

      • Speaker

      • 9:00-10:00

      • Registration

      • 10:00-10:30

      • Research on 6-8 Inch GaN+Si CMOS Monolithic Heterogeneous Integration and Platformization Devices

      • Huang Wei, Professor at the School of Integrated Circuits, Jiangnan University

      • 10:30-11:00

      • Application of WBG Technology in Motor Drives

      • Winter Cheng,Marketing Director & GaN Champion, Consumer, Computing & Communication, Infineon Technologies Greater China

      • 11:00-11:30

      • ST Power Device for Motor Control Application

      • Jerry LI, Technical Marketing Manager, Power Discrete and Sub-Analog, China, STMicroelectronics

      • 11:30-12:00

      • Practical Applications of Nano Probes in Chip Failure Analysis

      • Chua Kok Keng, Technical Director, Wintech Nano (Suzhou) Co., Ltd.

      • 13:30-14:00

      • Manufacturing and Testing Technologies of GaN Power Devices

      • Huang Huolin, Professor and Doctoral Supervisor at Dalian University of Technology

      • 14:00-14:30

      • Dynamic Reliability Testing Challenges and Solutions for SiC MOSFET from Wafer Level to Device Level

      • Saijun Mao, Founder, UniSic Technology(Shanghai) co., Ltd.

      • 14:30-15:00

      • Opportunities and Challenges in the Era of Silicon Carbide Wide Application

      • Li Guohu, Industrial Marketing Director, Sales and Marketing Department, United Nova Technology Co., Ltd.

      • 15:00-15:30

      • Encounter with Wide Bandgap Materials

      • Minfan Fu,Researcher and Doctoral Supervisor at School of Information Science and Technology,ShanghaiTech University

      • The agenda of conference shall be subject to the announcement on that day.

    On site photos of the forum

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